We provide comprehensive multi-stage inspection services seamlessly integrated into our electronic circuit assembly operations, in addition to on-demand batch analytical services. Our five-method AOI capability and sophisticated X-ray analysis system collectively achieve our objective of zero defects.
LET'S TALK ›Our zero-defect goal is supported by multiple fault detection and mitigation systems. This process begins with Automated Optical Inspection (AOI), proceeds to an X-ray inspection system, and concludes with two remote verification stations.
LET'S TALK ›Our AOI chain features cutting-edge 5-method inspection technology designed to catch bad solder, reversed polarity, and foreign material on PCBs. The 360° laser projection analysis is key to achieving accurate height measurement and eliminating shadowing, thus ensuring reliable inspection outcomes.
LET'S TALK ›We operate a General Electric Phoenix x|aminer X-ray inspection system which enables us to carry out inspections of solder joints, complex circuitry, mechanical components, and to conduct full-batch defect studies (e.g., searching for solder voids). High-resolution inspection images and corresponding reports are available to our clients.
LET'S TALK ›